Industry Directory | Manufacturer
Professionally provide RTP, PLasma Asher,Descum,Etcher, Sputter deposition, Metal thin film thickness measurement equipment made in U.S.A.
The main focus of this compact X-ray cabinet for manual real-time inspection are sample parts. The goal is to achieve the same brilliant image quality for a budget price by reducing the comfort items and advanced features of the XRH111. This leads to
Industry News | 2017-11-14 19:03:32.0
Munich – At this year’s productronica exhibition in Munich, YXLON International is launching its new X-ray inspection systems series Cheetah EVO and Cougar EVO. As technology advances at an ever increasing rate, YXLON has acknowledged that a “one size fits all” X-ray system in advanced electronics no longer delivers the best solution to the customer. So Yxlon now has custom-built systems for SMT, semiconductor, and laboratory applications perfected for the specific challenges and needs of the respective sectors. Keith Bryant, Global Director Electronics Sales at YXLON, states: “There is no need for customers to compromise anymore.”
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor L
New Equipment | Test Equipment
X-Ray Inspection System Features: Fully integrated, 130 kV high power closed X-ray tube Micro-focus Spot size down to 5µ 5′ x 5′ or 4′ x 3′ high resolution and ultra-resolution CMOS digital flat pane image detectors 60° camera tilt for obliqu
Application Field BGA/IC LED Aluminum Die casting Battery Connector Main Features of X-6600 X-Ray inspection machine * Closed Tube From HAMAMATSU Japan * Imported Detector from Korea Rayence * Micro-focus,focal spot size down to 5µm
Application Field BGA/IC LED Aluminum Die casting Battery Connector Main Features of X-6600 X-Ray inspection machine * Closed Tube From HAMAMATSU Japan * Imported Detector from Korea Rayence * Micro-focus,focal spot size down to 5µm
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
70 percent of SMT manufacturing defects are caused during the solder paste printing process. Detection of these printing defects can greatly increase the overall quality of finished products and decrease the human hours associated with post-process r
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semicon
