Full Site - : integrated passive components (Page 4 of 3273)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

SMTnet

ECA to Host EMS Industry Forum

Industry News | 2003-02-05 09:14:02.0

The Event will be Held in the Wyndham San Jose Hotel on February 20, 2003

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

Tyco Electronics Names Arrow Electronics 'Distributor Of The Year'

Industry News | 2003-05-15 08:37:06.0

Recognition for helping to extensively grow Tyco Electronics' product sales from 2001 to 2002

SMTnet

Pulse Offers Highest Power Density SMT Planar Transformer

Industry News | 2003-01-24 09:07:53.0

For Industrial, Telecom and Datacom Use

SMTnet

System Takes on Two-Component Gel Application

Industry News | 2003-04-28 08:12:02.0

The Micro-Meter 2 is an air-operated positive-displacement single-acting two-component system, designed to meter, mix and dispense small 'shots', or beads, of reactive materials.

SMTnet

KEMET Announces Enhanced Strategic Plan

Industry News | 2003-07-10 08:36:25.0

To execute this strategic plan, KEMET is reorganizing its operations around the world.

SMTnet

Integrated Test Corporation Partners with MIRTEC for Total Quality 3D AOI Solution

Industry News | 2020-05-18 13:26:01.0

MIRTEC is pleased to announce that Integrated Test Corporation, a leading fabricator of ATE probe and final test PCBs, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-7U OMNI Large Format PCB 3D AOI Machine.

MIRTEC Corp

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet


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