Electronics Forum: ipc and 610 and warp (Page 4 of 5)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

Any different between Flat Ribbon and Gull Wing Component?

Electronics Forum | Thu Apr 12 13:23:18 EDT 2007 | slthomas

On the contrary, IPC-610 refers to flat ribbon leads in the same context as gullwing and "L" leads. I've always assumed that they were one in the same (could be wrong here...certainly wouldn't be anything new) and have never seen L or flat ribbon r

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi

Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.

We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon

| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup

| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon

| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi

| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody


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