Electronics Forum: ipc-a-610 class 3 design (Page 4 of 10)

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval

We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

Looking for AOI programming tips, tricks, info

Electronics Forum | Sun Oct 17 11:26:36 EDT 2010 | methos1979

New to this forum and AOI. After an exhaustive search and review my company purchased our department a Mirtec MV-3L desktop AOI system. We use a combination of SMT and through-hole components in our product. I am currently learning to program th

Through hole SMD in SMT process-Length question

Electronics Forum | Tue Jul 19 18:05:31 EDT 2016 | davef

I'm not real clear on what you're looking to understand, but let me get things started ... IPC-A-610F - Acceptability of Electronic Assemblies, 7.3.3 Supported Holes – Wire/Lead Protrusion Minimum length: You need to be able to discern the compone

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1

Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim

8.2.5.5 Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

SMT electrolytic capacitor lead classification is???

Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks

Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c

How do you prove IPC-A-610 compliance to a federal agency?

Electronics Forum | Fri Jul 09 20:54:58 EDT 2010 | bandjwet

There is no such thing as "IPCA610 compliance". The correct way of looking at this that the boards were inspected to IPC Class I, II or III Revision XX (current Rev is "E") and met all of the criteria. From a commercial standpoint it would greatly

Conformal Coating Discoloration

Electronics Forum | Mon Aug 29 16:21:20 EDT 2011 | rjlasko

Greetings...I have a customer that has an assembly that is conformal coated with Humiseal 1A33. This assembly has some components (resistors and FET's) that heated up during operation and has discolored the conformal coating around their location.

How to improve the solder quality of QFN?

Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton

"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a


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