Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Fri Jan 19 02:03:09 EST 2007 | lococost
As a sidenote, if nothing of the above works, IPC 610 states that it is accetable (class 1,2,3) for solder to touch a SOT body if it is plastic.
Electronics Forum | Wed Jan 03 15:57:38 EST 2007 | realchunks
Is there a seperate guideline for Pin In Paste process in IPC? I have IPC610 year 2000 rev C (I know rev D is out). Or do most people use the thruough hole part of the Guideline as their criteria?
Electronics Forum | Thu Jan 04 13:12:22 EST 2007 | russ
do not touch copper boards, use cotton gloves. IPC 610 has some handling guidelines that you may want to look at. Russ
Electronics Forum | Tue Jan 30 13:50:59 EST 2007 | slthomas
Your customer needs to be beaten sensible with a copy of IPC-610. Strapping it to a 2x4 may increase efficiency.
Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Mon Jan 26 11:18:10 EST 2009 | evtimov
It seems like your parts are acceptable regarding IPC610. I would't bother if all in the specs. But the question is why you damage your partss in P&P process. I think you should avoid that instead of looking for standards. Regards, Emil
Electronics Forum | Tue Mar 17 08:20:59 EDT 2009 | scottp
I work for one of the largest automotive suppliers. Our Workmanship Standards pre-date IPC-610 but they are nearly identical in regards to solder balls. We supply to all the major OEMs, including the Japanese, and I don't recall our solder ball sta
Electronics Forum | Mon Mar 01 11:56:51 EST 2010 | pjc
Your IPC-610 workmanship manual will have the answer for you (I don't have the latest at my fingertips). Depends on what class you are building too, 1, 2 or 3 and the application of this connector on the product- which you must determine.
Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli
Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli
