Electronics Forum | Fri Jun 18 20:29:39 EDT 2004 | Ken
The problem is lead enrichment regions forming in the hottest part of the joint. The lead pool is the weakest part of the (SMT) joint. In TH interconnects hot tear or pad lift can result. I have recently seen this first hand.
Electronics Forum | Tue Mar 01 04:25:48 EST 2022 | shrikant_borkar
Dear Members Please help me to support to one of my client does not have co planarity in his SIPLACE D1i Pick and place machine. We would like to understand why this Lead lift up issue has passed thru pick and place.? Is there any method by keepin
Electronics Forum | Thu Mar 03 03:54:38 EST 2022 | gary_sastrillas
The only way can detect, play around with your vision teaching with the component. and adjust the pin tolerance.
Electronics Forum | Wed Mar 02 04:47:41 EST 2022 | shrikant_borkar
Dear All Hopefully you got the situation on SIPLACE D1i and SIPLACE D2i. Pickup up Place machines. Is the lead bend upward of SMT transistor detection is possible on this machine? If not is it possible to get it detects by optimising it's windows.
Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef
Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
Electronics Forum | Wed Jun 07 17:58:27 EDT 2023 | linux
are the ics jumping in the tray. if not seated correctly the lead lift at pickup. mostly lift lead causing by handling.
Electronics Forum | Thu May 04 04:29:05 EDT 2023 | abhishek10
we have observed a Field claim in ECU where root cause is Lead lift found in one of the IC. What could be the possible reason for lead lift and how to avoid the same in future. QFP is the Type 1.Checked the Part Library(3-D Check Refernece no.-23
Electronics Forum | Fri Jun 10 07:33:09 EDT 2016 | lilblevs11
I appreciate the insight. However, most of our lifted components are from connector's or relays. Basically a component with more than 2 leads. They tend to lift at the front of the component feeding into the wave. The rear end of the component does n
Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar
Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha
winsouce.jpg)