Industry News: manual bga replacement (Page 4 of 38)

Circuit Technology Center Releases Updated Bonding System

Industry News | 2021-11-12 04:07:03.0

Circuit Technology Center announces it has released an updated version of its popular Bonding System.

Circuit Technology Center, Inc.

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

Basic Soldering Guide – How to Solder Electronic Components

Industry News | 2018-12-08 03:25:54.0

Basic Soldering Guide – How to Solder Electronic Components

Flason Electronic Co.,limited

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Metcal’s Paul Wood to Present at IPC APEX 2014

Industry News | 2014-02-21 11:40:56.0

Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.

Metcal

Virtual Industries’ VC-3-075-AW-ESD VACULA 3 Kit with Barbed Anti-Wobble Fitting And 1 Cup

Industry News | 2018-10-15 19:04:17.0

Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, now provides a product line of hand tools that replaces tweezers or other gripping means for many applications. Virtual Industries’ most powerful ESD-safe self-contained tweezer, the VC-3-075-AW-ESD VACULA 3, is designed to handle parts when moving them into and out of burn-in trays, test sockets or other component transfer operations.

Virtual Industries, Inc.

Virtual Industries Introduces New Low-Cost Vacuum-Tweezer Tool

Industry News | 2009-02-09 16:00:37.0

COLORADO SPRINGS, CO � February 9, 2009 � Virtual Industries, Inc., a leading supplier of manual vacuum handling solutions, introduces the self-contained manually operated PEN-VAC PRO-SERIES Vacuum-Tweezer for handling SMD packages, optics or other small parts during assembly. The tweezer has no vacuum hoses to get in the way and no batteries to replace.

Virtual Industries, Inc.

NIKON Metrology Showcases the Inspect-X 4.1 Which Provides Ultra-Sharp Images And Advanced BGA analysis at Electronica Munich

Industry News | 2014-10-13 16:23:05.0

Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.

Nikon Metrology, Inc.

New SIPLACE import function for irregular BGAs

Industry News | 2010-05-11 15:23:38.0

To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.

Siemens Process Industries and Drives

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix


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