Electronics Forum | Thu Jan 28 14:23:25 EST 2021 | davef
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Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Wed Apr 06 00:36:32 EDT 2005 | vinitverma
Hi, Well said Grant! I guess this margin on the component procurement is the largest contributor in the overall margin for big EMS companies who have global component sourcing and hence very competitive pricing for the same! As regards conversion co
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
Electronics Forum | Mon Jul 16 14:38:22 EDT 2001 | ohboy
If your pad designs don't meet IPC recommendations, using home plate may have adversely affected the (possibly marginal) placement tolerances. This could also be caused by an incorrect home plate design, which IPC has also given recommendations for,
Electronics Forum | Thu Jan 27 14:16:14 EST 2000 | Tuan Bui
I've tried Indium NC-SMQ92(96.5Sn 3.5Ag) on these MCMs and achieved only marginal wetting on pads and parts. The good wetting is what I try to achieve, shiny is what my engineers want (Prototype environment). Does pre-cleaning the PWBs in ultrasonic
Electronics Forum | Thu Jun 11 22:03:56 EDT 1998 | Dew Lolly
We own a BTU Convection Oven. Nitrogen helps make shiny joints since it reduces oxidation during reflow. It has helped us solder marginal solderably boards but otherwise if "pretty" and "shiny" is a requirement I would consider it. It doesn't turn
Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez
I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us
Electronics Forum | Fri Mar 14 23:41:11 EST 2003 | MA/NY DDave
Hi Well maybe someone else has better info yet I don't see this fully associated with density of package. As long as the process gives a good Electroless NI, Immersion AU you should be OK. If it doesn't and the process output is marginal as has been
Electronics Forum | Wed Oct 29 17:52:41 EST 2003 | adlsmt
What kind of equipment do you have now to do the 1 off boards? Is there enough profit margin to process the 200 the same way? If not, there is not enough to justify new equipment and to outsource 200 pcs with 100% traceability requirements would