Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Thu Mar 15 21:09:07 EDT 2007 | KEN
Cecil, the board is a component.
Electronics Forum | Thu Mar 15 10:28:46 EDT 2007 | cecil
Just askin but why would someone even want to subject an assembly to even 6 reflow cycles? As far as how many cycles that an assembly can be subjected to, wouldn't that be determined my your components?
Electronics Forum | Thu Mar 15 09:58:22 EDT 2007 | KEN
Anyone know which IPC document covers this? Me thinks 6....but want the IPC spec. to back this up.
Electronics Forum | Thu Mar 15 20:49:16 EDT 2007 | davef
There is no IPC document, nor should there be. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=48102
Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip
To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
