Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip
To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Wed May 28 08:25:08 EDT 2003 | davef
That's what we do [no more than three reworks or mods]. Your "four reworks permissable" was probably based on the 55110 five thermal cycles, counting wave soldering as the first cycle. How do you plan to keep track of each of those rework actions?
Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho
HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
