Electronics Forum: mfu and connection (Page 4 of 9)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan

thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod

contact pick and place table not homing

Electronics Forum | Fri Oct 13 10:36:51 EDT 2023 | barty

Hello! To download TikTok videos and then watch them without internet access, https://savetiktok.org is the perfect solution. This service allows you to download videos and save them to your device, allowing you to enjoy the content even where there

YV100XG Password and how to change AxisNo

Electronics Forum | Tue Nov 01 16:09:38 EDT 2022 | kamedatec

The machine had the Auto Tray installed but was removed to put here in the company because the machine was bigger than my elevator. The owner told me it was working, which made me waste time testing all possible settings, electronic cards and cables.

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas

We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor

First PCB and it didn't work

Electronics Forum | Tue Jan 07 02:04:45 EST 2020 | robl

Hi Mikey, Your signal pins (2 & 3) for USB1, 2, & 3 are all connected together so there is no way of splitting the incoming signals from the 3 ports. Normally there would be an IC (a USB hub controller) switching between the signals so that the PC

soldering and bonding on gold PCB's

Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef

For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s


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