Electronics Forum | Thu May 29 00:26:58 EDT 2008 | bobwillis
Bob Willis' Top Ten Reference Books Here is a new list of "Bob Willis' Top Ten" reference books that has been updated for 2007 to take into account recent changes in technology. In the publishing industry there are many charts and awards for the bes
Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014
Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re
Electronics Forum | Thu Apr 15 14:56:43 EDT 1999 | Dave F
| Can anyone suggest or identifiy standards which tabulate the following: | | Conductor width, cross sectional and area conductor thickness for PCB's carrying up to 70 Amps? | Barry: Check: 1 Printed Circuits Handbook (Clyde F. Coombs) 2 Microel
Electronics Forum | Thu Mar 12 07:35:27 EST 1998 | Cathy Aplin
Don't know how relevant this is to you, but try Electronics and the Environment, a Millennial Retrospective edited by Brian Ellis on behalf of Circuit World, Soldering and Surface Mount Technology and Microelectronics International on the Web. So far
Electronics Forum | Wed Oct 19 07:30:25 EDT 2005 | davef
Try: * Electronics Manufacturing Productivity Facility (EMPF) 317.226.5640 Ray Cirimele 317.231.2045fax226.5673 * National Training Center for Microelectronics Northampton Community College 3855 Green Pond Rd Bethlehem, PA 18017-7599 610.861.4553f
Electronics Forum | Tue Apr 30 05:05:16 EDT 2013 | pavel_murtishev
Colleagues, Now I am involved into plant ramp-up where 3x Panaconic NPM-W will be installed. New production hall is being designed right now and the problem is that constructors have never met SMT shops and know very few or next to nothing about requ
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef
5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Fri May 16 05:31:51 EDT 2003 | mario1304
Hello everyone! My first day as a registered user and the first post in the forum. I�m a student and I�m going to write my diploma thesis about traceability in microelectronic productions. At the moment I�m collecting every information about this top
