Electronics Forum: nickel and seperation (Page 4 of 6)

Re: BGA and Gold Boards

Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

UPS on a pick and place machine

Electronics Forum | Tue Aug 05 13:04:35 EDT 2003 | caldon

Our machines are Single phase 220v. The big honkin' hubble plug goes right in the back of the UPS for the whole machine...no seperate lines for the PC's. Also the UPS is dedicated just to the machine even though it has a 120v Recepticles. Cal

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 15:55:42 EST 2004 | davef

Dennis: The IPC-A-610 requirements are seperate. * You need to meet all acceptance requirements, in order to be in compliance. * If you reject a part for any reason, you are not in compliance.

Re: 0402 Components and Solder Paste

Electronics Forum | Thu Jul 20 14:57:26 EDT 2000 | Bob Willis

I have just measured my new test board and the dimensions are 0.025� square, 0.015� seperation with resist aperture 0.004� larger. Don�t know when I will be using it yet. I have not seen a head to head with these pastes yet, I know that Panasonic ar

Immersion Au and ENIG surface finishes

Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef

They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm

Palladium Nickel and Palladium Cobalt plating

Electronics Forum | Tue May 14 22:09:04 EDT 2013 | ultimatejoker

Hi, what is significant different between PdNi and PdCo Plating? I found in some papers indicate that the deposit characteristics for both plating is totally the same.

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris

Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia

Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board

force between the pad and laminate material

Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny

When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b


nickel and seperation searches for Companies, Equipment, Machines, Suppliers & Information