0.2mm nickel silver copper rf PCB shielding can conductive soldering material China ISO manufactuer Any RFQ please send mail to us any time
EMI RFI nickel silver shielding cover and frame for medical device solder on PCB ISO 9001 2015
Industry Directory | Manufacturer
Integran makes nanocrystalline nickel SMT solder stencil blanks that are subsequently laser cut into the high durability and very precise stencils. We make 500-1000 a month of 22.5" x 24" foils.
Industry Directory | Manufacturer
Integran's hard nickel blanks for SMT solder stencils can be laser cut into the highest performance solder stencils on the market. Quality is underpinned by Integran's strong analytical capabilities.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
MET is ready to meet your stencil requirements. We manufacture Electroformed Stencils, Laser Cut Stencils and Chemically Etched Stencils for various solder paste and glue printing applications.
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
New Equipment | Solder Materials
Economical solder for repairing & joining most metals including Aluminum and cast Iron. Has been the standard for cast Iron and galvanized surface repair for over 60 years. Low application temperatures prevent loss of properties and minimize distor
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
New Equipment | Solder Materials
WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cabl
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
