GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
-Line 2 Die, 2 Lead Radial, Stand-Off, Opposing Dimple 2C Die, 2 Lead Radial, Lock-In Stand-Off, Opposing Dimple 3 Die, 2 Lead Radial, Lock-In Stand-Off 4A Die, 2 Lead Radial, Spreading 4B Die, 2 Lead Radial, Reducing 5 Knife 7 * Die, 2 Lead Radial, 90
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
-Line 2 Die, 2 Lead Radial, Stand-Off, Opposing Dimple 2C Die, 2 Lead Radial, Lock-In Stand-Off, Opposing Dimple 3 Die, 2 Lead Radial, Lock-In Stand-Off 4A Die, 2 Lead Radial, Spreading 4B Die, 2 Lead Radial, Reducing 5 Knife 7 * Die, 2 Lead Radial, 90
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
the right hand side of each die and knife (Figure 23): Forming Style Series Number Description 1 Die, 3 Lead Radial (typically TO-92), In-Line 2 Die, 2 Lead Radial, Stand-Off, Opposing Dimple 2C Die, 2 Lead Radial, Lock-In Stand-Off, Opposing Dimple 3
GPD Global | https://www.gpd-global.com/pdf/lead-former/CF9-Doc-Package-901-1-01.pdf
the right hand side of each die and knife (Figure 23): Forming Style Series Number Description 1 Die, 3 Lead Radial (typically TO-92), In-Line 2 Die, 2 Lead Radial, Stand-Off, Opposing Dimple 2C Die, 2 Lead Radial, Lock-In Stand-Off, Opposing Dimple 3
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. An opposing school of thought was that voids act as crack arrestors, which improve solder joint life. The root cause of voids in BGA solder joints is well understood by the electronics industry with a number of papers published on the topic [1, 2, 3]. R
