Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson
I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha
Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson
Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,
Electronics Forum | Thu Jan 03 19:26:04 EST 2002 | ianccy
Thanks guys, it's very helpful.
Electronics Forum | Thu Jan 03 06:58:41 EST 2002 | Scott Davies
MSL is "Moisture Sensitivity Level", and you should be able to find information on the websites of individual component manufacturers. For example, take a look at Infineon; http://www.infineon.com/greenproduct/msl_classification1.htm
Electronics Forum | Thu Jan 03 14:12:45 EST 2002 | davef
I know fmonette has a MSD audit check list. Maybe when he posts, he'll give us a MSD control procedure aimed at operations types.
Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Jan 03 08:01:23 EST 2002 | davef
In addition to a previous poster's comments, you many want to understand moisture sensitive components better. Start with: * J-STD-020 and J-STD-033. Download them here: http://www.jedec.org/download/default.cfm * �Moisture Sensitive Components� R
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
