Electronics Forum | Fri Mar 23 09:13:48 EDT 2007 | Peter W
Hello, those plated and solderable via in pads have two critical points: 1. We have discovered that _sometimes_ the plating seems not to be perfect, as extreme voiding is visible in tha bga solder ball 2. The detection of some defects by AXI is limi
Electronics Forum | Tue Aug 24 12:20:33 EDT 2004 | davef
The methods Terry mentioned are good, but our operators are too impatient. Here's how they do site prep, after removing the BGA: * Use a soldering iron to melt the solder at the base of the ball. * Flick the ball[s] from the pad[s] with the solderin
Electronics Forum | Fri Jan 29 10:09:27 EST 1999 | Robert Cass
Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted.
Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
Electronics Forum | Thu Nov 07 21:50:58 EST 2002 | Juan C. Ruiz
I work in a plant located in Monterrey Mexico, I would like to know where I can sent some boards to be analized since we have the suspect to have a black pad problem with the boards. Any Idea?
Electronics Forum | Fri Dec 20 12:12:12 EST 2002 | russ
Thanks Dave, I was looking in the Murata data base and couldn't even find the part (Even though they are the ones making it)let alone the pad dims. This part looks like it could be fun anyway. Russ
Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Tue Mar 11 08:33:31 EST 2003 | davef
SMTA [www.smta.org] New On-line Presentation - March 14 Dealing with the Black Pad Defect in Manufacturing Solectron Vice President of Technology Srinivas Rao And Director of Process Integration Kim Hyland Date: Friday, March 14 Time: 10:30AM - Noon
