Electronics Forum | Wed Sep 22 08:26:53 EDT 1999 | g cronin
i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the screen/ass
Electronics Forum | Wed Jan 12 21:37:04 EST 2005 | KEN
How thick is this pallet? 6mm, 8mm, 10mm? I would look at: Make sure you're pot height is correct (lead clearance). If you are burrying the pallet in the fountain, your going to "push" a large volume away. The solder "push" should not plow over t
Electronics Forum | Wed Jan 12 13:57:28 EST 2005 | russ
Are you positive that the solder is sticking to the bottom of the fixture OR is it pushing the wave down so far that the solder is "squirting" out from underneath the pallet. This happens when deep/thick pallets are run at the same wave height as a n
Electronics Forum | Wed Jan 12 10:05:37 EST 2005 | SuePH
Help!! Just got some new wave solder pallets in house. The pallets are 12 by 8 inches solid composite, with only two 1/2 inch by 1 inch spots cut out for the connectors. When they go over the wave, the solder wants to cling to the bottom of the pal
Electronics Forum | Thu Oct 13 00:18:36 EDT 2011 | kemasta
Hi! We have many PCBA with double side BGA mounted, current practice is to put the board on reflow pallet (durastone 761) to cover BGA at bottom side so that the BGA won't lift after go through reflow oven, but this created 2 problems:- 1) We need t
Electronics Forum | Thu Oct 13 10:44:18 EDT 2011 | spitkis2
Have you considered adding adhesive / epoxy at the corners of the BGA to secure it in place?
Electronics Forum | Wed Jan 12 16:11:26 EST 2005 | russ
I have seen the solder shoot out at least 4"-6" from both the leading and trailing edge when this happens. If the open pockets are real deep you may want to use a turbulent/chip wave for soldering, sometimes this leaves bridges however.
Electronics Forum | Thu Oct 13 14:24:10 EDT 2011 | dphilbrick
You can use a paste that flows at 2 different temps. (first side flows hotter than second side) Glue, as stated in other answer and capton tape covering the BGA will defect enough heat usually as well.
Electronics Forum | Thu Oct 13 16:08:11 EDT 2011 | davef
BGA solder joint reliability is actually improved slightly from a double-sided reflow. [Jean-Paul Clech APEX 2003 Solder Joint Reliability of BGA Assemblies]
Electronics Forum | Thu Oct 13 23:50:50 EDT 2011 | kemasta
Hi Doug Nice idea (2 type paste), I will have a trial. We think of glue and tape too, but it involve cost, but we still keep as an option. thanks.
.png)