Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Fri Apr 28 10:50:26 EDT 2017 | emeto
Hello experts, Here is my problem: I have a board that has smt parts on one side and TH parts on the other. We designed special pallet for wave, but the pallet itself is 15mm thick, so we are still seeing some defects. Have any of you tried to find
Electronics Forum | Tue Oct 24 19:40:40 EDT 2000 | Dave F
From the SMTnet Library Terms & Definitions [er whatever they call it] � Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositi
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael
No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa
Electronics Forum | Mon Feb 07 14:25:43 EST 2011 | rodrigo
Hi all, This machine is pretty good. Thanks to all that have been helping me out with this. I have another question ... Some PCB have footprints that are a bit larger than the actual part (0805, 0603) so they move when they go through the reflow ove
Electronics Forum | Thu Nov 16 22:01:16 EST 2000 | Early Moon
I promised never to do this - BUT only for you needy folks when I have nothing else to do. And Dave's basically a good person though not as needy as most really needing this stuff. 1) Ensure internal Gerber data really matches board and stencil (Ger
Electronics Forum | Tue Mar 22 17:08:01 EST 2005 | finepitch
We might need to open up the term "mass production" here, but I will give it a try anyway. I've seen semiconductor packaging companies in the far east where they pick up balls with a vacuum head, consisting of holes matching the pattern of the BGA p
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata
Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft
