Electronics Forum | Tue Oct 23 03:57:39 EDT 2007 | jkhiew
Thanks Dave. But I do not understand why the solder being wicking away by the component itself. Does Ag/Pd finishes has stronger wettability than LF HASL finishes ? Rgds
Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Electronics Forum | Mon Mar 08 11:42:05 EST 2004 | Jay
Sn-Ag, Sn-Sb, and Sn-Cu based lead free alloys have a higher melting point than that of Sn-Pb eutectic system. Thus, it will be better if you can use a higher TG PCB for lead free purpose. But, also most of commercial products including SAC can be
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Electronics Forum | Tue May 23 09:27:37 EDT 2006 | Steve
Sorry I misled you. The PCB pads are wetting, but there is no fillet being formed. After reflow, it looks as though no paste was put down on the pads; however the paste print is fine. All other components solder real nice, it's only the Pd-Ag parts t
Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel
I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v
Electronics Forum | Thu Feb 21 08:11:44 EST 2008 | scottp
I agree, the level of Pd plays a role here. Knowing that some versions were probably OK we tried to develop a soldering test for PdAg components with pass/fail criteria, but decided it wasn't worth the engineering effort for a finish that's so rarel
Electronics Forum | Mon Oct 22 05:04:08 EDT 2007 | jkhiew
Hi, Recently we have encountered solder wicking on components termination (total of 13 pcs of components on one pcb)with Ag/Pd finishes during lead-free reflow soldering. The pcb is LF HASL surface finish and LF solder paste composition is SAC305.We
Electronics Forum | Thu Jun 29 04:07:25 EDT 2006 | slaine
Hi I manufacture a range of components with Ag,Pd,Pt terminatons. Has the solder wetted to the componet and is the termination still left on the component? I would expect the solder to remain on the pad though, if all your other devices on the pcb ar
Electronics Forum | Mon Oct 22 21:34:36 EDT 2007 | davef
Double check on this, but we have this little voice in our heads telling us that your AgPd termination is intended for conductive adhesive applications. Check with your component supplier. We recall a thread on SMTnet [ http://www.smtnet.com/forums
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