Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Oct 11 03:17:52 EDT 2002 | Adam
Guys I was wondering if anybody has some useful advice with regards to achieving 100% solder penetration on one pin of a through hole device which I believe is attached to a ground plane. All other pins on the through hole device are fine, Just this
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Fri Apr 11 13:59:06 EDT 2003 | MA/NY DDave
Hi Wow, Quite elaborate. My Mechancial Engineering, Thermo friends would be proud of you. I am not kidding. The only problem I have with your technique is that quite often internal lands and structures steal the heat during soldering. By your techn
Electronics Forum | Tue May 20 12:35:45 EDT 2003 | Mike Konrad
This probably a reflow issue, not a cleaning issue. Although ultrasonic cleaners are not normally used in post-reflow applications (fear of internal wire bond damage), I have never heard of broken solder joints caused by an ultrasonic cleaning syst
Electronics Forum | Fri Feb 20 17:04:26 EST 2004 | Long
Hi I am looking for some type of peelable mask or plug to cover the connector during the conformal coating. The problem we have is the moisture get into system and eventually penetrate under the connector creating short circuit to the board. What I r
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Wed Sep 15 05:15:24 EDT 2004 | Adam
I have chceked the fluxing application, I seem to be getting good consistent coverage across the board using our foam fluxing system. Good flux penetration on the top-side of the through-hole plating, as this was checked using a fax paper.There is no
Electronics Forum | Mon Aug 22 11:49:59 EDT 2005 | pjc
Fixed spray head performance depends on board width. If you are looking for complete top-side hole fill, the flux penetration into the lead-hole will be more in the center and less on the ends because of the fan pattern spray. For board widths over 6
Electronics Forum | Fri Oct 14 09:21:36 EDT 2005 | lupo
According with temperature vs. wetting force diagram 245-250C/degrees is better, so lower temperature than 500F means better solder fill. If the speed is too lower the solder suck out form the hole. Usually 120-150cm/min. is good. (2-4s contact
.gif)
