Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny
It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox
Electronics Forum | Fri Jun 15 14:05:20 EDT 2001 | CPI
In response No that�s not all you need to think about, but lets look at each and then talk of others. a)The condition of the solderable surface on boards (and components) degrades over time or can be supplied in poor condition (to thin or thick HASL
Electronics Forum | Fri Jun 18 14:06:15 EDT 1999 | John Thorup
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Tue Jun 28 07:27:32 EDT 2005 | Matt Kehoe
We are experiencing a situation that we would really appreciate some expert opinions on. Our process prints solder paste then reflows it without components. Normally the paste wicks into a very shiny rounded meniscus. Even over gold, the round pads a
Electronics Forum | Wed Jun 08 13:49:48 EDT 2011 | sonofptolemy
Hello, I am having a problem with HASL PCB's after it comes back from the stuffer. To me it looks like oxidation and it causes poor wetting. This leads to a bunch of problems all of which have different symptoms but the cause is this oxidation proble
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Wed Feb 09 19:55:27 EST 2000 | Russ
Hello All! I have a problem that hopefully someone out there might have some ideas. I have an assembly that upon the "dental pick test" the entire solder fillet is coming up with the lead and leaving what appears to be a bare pad. I believe that th
Electronics Forum | Thu Feb 10 09:43:42 EST 2000 | Glenn Robertson
Russ - I agree with Dave and Wolfgang that the boards are the top suspect. The idea of "rework" from Gold to HASL sounds scary. Are you sure the Gold is electroplate and not immersion? Resolve that and then check the archives for "dark pad" or
Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper
Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and
Electronics Forum | Fri May 16 15:45:00 EDT 2003 | swagner
If the only difference between the two products is the board supplier I believe thats where I would start, we had a similar problem like this two months ago and it turned out to be a faulty (thin) HASL layer which did not meet our print tolerance. T
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