| http://etasmt.com/te_news_bulletin/2021-08-31/23570.chtml
:3 Process and design-related causes: • Non-coplanar leads on the component • Excessive warpage of the PCB or substrate • Poor wetting • Insufficient amount of solder due to improper printing parameters
Surface Mount Technology Association (SMTA) | https://www.smta.org/southeast-asia/
. Many engineers approach the problem by tweaking process parameters on fluxing, preheating, solder pot temperature, wave height adjustment and others, it merely be just a containment and not able to
| http://etasmt.com/te_news_bulletin/2021-08-31/23567.chtml
. Besides having a high-quality (and qualified) solder paste, parts and boards with good solderability are also required. Control of the procurement and storage of parts and PCBs is essential
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23567.chtml
. Besides having a high-quality (and qualified) solder paste, parts and boards with good solderability are also required. Control of the procurement and storage of parts and PCBs is essential
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
Air Reflow Oven,SMT Reflow Machine,SMT Reflow Oven Manufacturers,Lead free Solder Reflow,LED Reflow Oven,Ir Reflow Machine,Lead free Reflow Oven SMT Line Wave Soldering JUKI SMT Pick and Place Machine
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5454
: Sn-Ag-Cu (SAC) solders generally have better thermal cycling performance than eutectic Sn-Pb. However, their performance deteriorates significantly as the harshness of the thermal cycle increases, and the high-Ag SAC solders that perform best in thermal cycling have relatively poor drop impact properties
| https://www.eptac.com/faqs/soldertips?hsLang=en
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips
| https://www.eptac.com/faqs/soldertips
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips
