Electronics Forum | Fri Apr 23 11:42:30 EDT 2004 | patrickbruneel
Thanks for the answer. what i believe happent is that the manufacturer of the paste reduced the tackiness of the paste to eliminate the squeegee sticking problem, and now with the reduced tack its a lot easier for the powder particles to break off du
Electronics Forum | Thu Jan 12 20:11:25 EST 2012 | davef
Isola water pressure. Between a 210°C normal tin lead cycle and a 250°C lead-free assembly cycle, the vapor pressure doubles. Reflow temperature [*C]||Vapor pressure of water [psi] 150||100 200||225 210||260 220||320 230||400 240||480 250||580 300||1
Electronics Forum | Thu Jul 28 05:41:22 EDT 2005 | K
Hi guys, Have any of you encountered harwin connector M80-647 in the past? Have you noticed any problems with the reliability of the component, solderability and 'reworkability' (thats a new word for sure)? Heres a PDF of the component; http://www.
Electronics Forum | Fri Apr 27 13:04:35 EDT 2007 | rmitchell
Hi, I am having some problems with my Fuji CP6 placement repeatability. The placement drifts during the build about .06-.10 mm on parts. It has happened on several different builds this week. It is enough to cause some defects after reflow on smal
Electronics Forum | Fri Oct 02 11:14:10 EDT 1998 | Scott Cook
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Ben, We us
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Fri Aug 04 04:26:31 EDT 2000 | Charles stringer
I am experiencing a problem when soldering down a TO263 package. The device has a large solderable tab (approx 8mm square)on the back and 5 leads. Sometimes the leads are not soldered to the board properly. I am using a metal mask with 9 "windows" of
Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz
Thank you Pavel. Aleksander
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
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