Electronics Forum: reflow profile (Page 4 of 260)

Re: reflow profile

Electronics Forum | Fri Nov 24 07:10:39 EST 2000 | Chris May

Sarry, Word on the street is that your profile will have to be hotter, maybe up to 20C hotter, I have trialled lead free. The sales guy said, "Right, lets reprofile your oven ! I said, "No, lets try it as it is.....! The results were fine, as the

Re: reflow profile

Electronics Forum | Mon Dec 04 20:30:40 EST 2000 | Michael Parker

Flavor???? I have always been partial to Wintergreen, but be sure to get it with the Tarter Control for cleaner apertures and baking soda for a brighter finish

Coolingproblem in reflow profile

Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng

It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.

Coolingproblem in reflow profile

Electronics Forum | Tue Jun 14 18:32:44 EDT 2005 | GS

Hi Peter, which should be the best cooling rate once belove TAL by using L-F alloy ie. SAC 305 ? Tnks GS

Coolingproblem in reflow profile

Electronics Forum | Tue Jun 21 07:39:23 EDT 2005 | davef

There's a fair amount of material on cooling rates for lead free on the web. Look here: * http://www.speedlinetech.com/docs/Cooling-Slopes-Lead-Free-Reflow.pdf * http://www.findarticles.com/p/articles/mi_qa3776/is_200412/ai_n9473486 * http://www.m

BGA reflow profile

Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl

No-clean reflow profile

Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell

183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so

Coolingproblem in reflow profile

Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef

Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.

Coolingproblem in reflow profile

Electronics Forum | Mon Jun 20 21:54:38 EDT 2005 | darby

Contact your paste supplier and see what they say. My information on SAC 305 FROM MY SUPPLIER was - "The cool down rate is not as critical for Pb-free solder joints, as it was for SnPb. The grain sizes do not differ is size in the Pb-free bulk solde

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman

| Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und


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