Electronics Forum | Tue Apr 01 19:23:12 EDT 2008 | guhansub1
Just curious...What is the gap between the pads? If it's less than 3 mm, it's recommended to do gang relief. Otherwise the soldermask will peel off during rework.
Electronics Forum | Tue Jun 03 22:54:54 EDT 2008 | davef
This might be a good starting point for you: http://pcdandf.com/cms/content/view/3760/95/
Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Thu May 17 09:24:30 EDT 2012 | davef
These notes are from ~2005-6. I remember pictures of the pallets and the reliefs on the stencil. Bob may still have his presentation online. Check his site.
Electronics Forum | Mon Sep 17 12:21:43 EDT 2018 | bpeay
M_, the parts may be similar but the boards look to be different. Is the thermal relief for each lead on each board the same? what is the board finish, HASL, Enig, OSP or other? The part itself may not be your problem but the part that is partial pla
Electronics Forum | Thu Feb 10 09:08:21 EST 2000 | C.K.
We've got this hard-to-Wave-solder board where all of the SMD's are on a ground plane - in fact the entire bottom-side is a ground plane. Our designers have incorporated thermal relief on some of the pads, but for reasons unknown to us, they don't h
Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Mon Dec 18 16:13:15 EST 2006 | darby
AJ, No overprint. We have components in very close proximity that precluded that. Also we have differing areas of thermal relief for the pads from a large backplane, from none at all to open blocks to individual pad relief. After a few more experimen
Electronics Forum | Mon Jun 25 16:16:01 EDT 2012 | rway
I have some suggestions. We have been fighting bad fids for years. Some things we have tried that have helped is: 1) Look at your relief area around your fid. Does it butt up against the solder mask. We allow 20 mil around the fid as a relief ar
Electronics Forum | Mon Jul 31 13:50:27 EDT 2000 | debandrick
Mike, with all due respect, the customer service that MVT provides is poor at best...more accurately non existent. Our company has had more correspondence with their anwering service than any living breathing personell. The GS-1 has some inherent f
