Electronics Forum | Tue Aug 24 15:11:32 EDT 2010 | sjohnson
We are experiencing a high incidence of what we call "black barrel" (to differentiate from black pad) with multiple contract manufacturers and PCB vendors. The PCBs are ENIG and during wave solder (SACX-0307) multiple thru-hole components are seeing
Electronics Forum | Sat Jul 28 15:59:18 EDT 2018 | davef
Search the SMTnet Archives for threads like: * http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=14504&#Message60895 * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=5127 * http://www.smtnet.com/forums/In
Electronics Forum | Fri Mar 07 04:25:29 EST 2008 | mun4o
Hi, i try to collect data for solder wave process defects, but I dont know how I must calculate these data.Can anyone help me - may be there nave some free software for this.I want to calculate how many ppm is our deffects.And, how is acceptable ran
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Sun Sep 15 08:35:42 EDT 2002 | davef
That 60+% print defects number has been bantied around for so long in the electronic assembly business for so long that people believe that it's true. One starting point for this myth and lore is: "Where Quality Is Lost On SMT Boards" C Mangin, 'Cir
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Fri Oct 30 10:36:26 EDT 2009 | richie_puthotta
Hi, I see a huge solder mask shift on chip comp pads. This would result in mid-chip solder balls or solder beads. Overall, the solder mask workmanship is not acceptable. Mask is on pad.
Electronics Forum | Tue Nov 03 06:23:12 EST 2009 | josh_brubaker
Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an acceptable method for testing solder resist acceptability? This is an issue I am experiencing with our PCBs. I am receiving boards with excess solder o
Electronics Forum | Mon Nov 02 22:02:01 EST 2009 | boardhouse
Umar - the boards are not assembled - so Solder splash is not applicable. Solder resist does not Melt it cures. As a board supplier I would not want my clients to adapt if they are receiving crap product, I would expect them to leave.
