Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill
I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a
Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward
Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi
Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir
Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll
Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks
Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
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