Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef
Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking
Electronics Forum | Thu Feb 14 09:24:58 EST 2013 | adrianus
Hello, We need information regarding the specifics of soldering Nickel Silver in a reflow process. Is there a specific process / flux / cleaning / Temperature curve / or whatever required in order to properly process parts from this material? Nicke
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Thu Jun 26 10:02:06 EDT 2008 | rdnggbsss1
I am a PCB Designer and I have to put a note on the assembly drawing to tell the assembler how to clean the board. This is new to me. Here is a sample note. Can someone give me some feedback on it? "Use water washable, no clean solder paste for t
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Wed Jun 10 18:50:36 EDT 1998 | Earl Moon
| | | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | | Example: | | | Screen Print = 45% of total defects | | | Component Placement = 25% of total de
