Full Site - : solder fines in no clean (Page 4 of 6)

Has anyone heard of a no clean paste that can be cleaned in straight DI water ?

Electronics Forum | Thu Feb 01 08:46:54 EST 2018 | charliedci

Your right, he is "selling it". Or I should say he is not selling no-clean solder paste.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

PLCC LEADS not solder in SAC305 paste

Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1

Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M

Solder Balls in Vias

Electronics Forum | Tue Jun 04 13:13:58 EDT 2002 | slthomas

Another thing we see is solder balls (sometimes fines, sometimes larger stuff) in the vias after a misprint has been poorly cleaned, as in wiped down but not washed. They end up in the plated through holes too, but those get nicely cleaned up in the

Solder Balls in Boards

Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324

Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,

Solder particals in the oven?

Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob

No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe

Solder particals in the oven?

Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef

Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula

Component missing in siplace mounter

Electronics Forum | Tue May 07 13:49:05 EDT 2019 | tey422

Like I stated before, I am not familiar with the machine. I can only make suggestions. If you found solder paste on the nozzle, clean it off to prevent part stuck to the nozzle tip. I would also check if the nozzle tips are being worn off; uneven we

Excess Flux in uBGA rework

Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman

If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle

Nitrogen use in reflow and wave

Electronics Forum | Sat Apr 20 10:12:16 EDT 2002 | davef

If people use an inert gas, they use nitrogen for mass soldering. Inert gases get progressively more expensive as you move down the periodic table. Many times no-clean flux is less active than other flux types. So, people use an inert gas to lower


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