Full Site - : solder joints fatigue (Page 4 of 590)

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

Viscom S3088AV

Viscom S3088AV

Used SMT Equipment | AOI / Automated Optical Inspection

Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:

Baja Bid

MPM UP2000 HiE Screen Printer

MPM UP2000 HiE Screen Printer

New Equipment | Solder Paste Stencils

MPM UP2000 HiE Screen Printer Substrate treatment                                                       Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

JUKI High -Speed Compact Modular Mounter RX-7R

JUKI High -Speed Compact Modular Mounter RX-7R

New Equipment | Assembly Services

Specification Model Item High -Speed Compact Modular Mounter RX-7R (P16SxP16S head) (P16Sxp8 head) (P8xP8 head) Board size Single lane conveyer

KingFei SMT Tech

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested

Technical Library | 2020-12-07 15:26:06.0

Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.

ACI Technologies, Inc.

SMTA International Conference on Soldering and Reliability Program Announced

Industry News | 2011-02-24 20:35:03.0

The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

2003 Hutchins Grant Award Recipient Announced

Industry News | 2003-07-03 09:11:01.0

Andrew Perkins from Georgia Tech University has been selected by the SMTA Grant Committee to receive the award

Surface Mount Technology Association (SMTA)


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