Electronics Forum | Tue Sep 11 19:04:28 EDT 2007 | hakerem
Hi Shrek - Not sure why you think adjusting dwell time and preheats is a sales pitch, but I do appreciate your candor. These are proven, widely used techniques for attacking, eliminating and preventing the recurrence of blowholes. Since it is so ea
Electronics Forum | Wed Apr 14 20:48:43 EDT 2004 | Ken
Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can
Electronics Forum | Fri Apr 23 15:10:45 EDT 1999 | Chrys Shea
| We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be ens
Electronics Forum | Thu Apr 29 16:56:16 EDT 1999 | Kevin Hussey
| | We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be e
Electronics Forum | Tue Oct 28 09:24:10 EST 2003 | davef
Running a soldered BGA through a wave solder pot is very risky: * 230-240*C temperature of the pot could damage the device. * Solder in the pot will certainly cause bridging between BGA solder balls. * Solder in the pot could melt BGA solder balls.
Electronics Forum | Tue Oct 28 10:45:22 EST 2003 | Gabriele
After following the suggestions above, and where it would not be possible to mask BGA by soldering fixture, a Kapton tape (pre-punched) can be placed under BGA ( wave solder source side ) it can help to keep temperature low enough avoiding "seconda
Electronics Forum | Fri Nov 30 11:49:20 EST 2007 | nkb2400
If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS met
Electronics Forum | Mon Nov 19 13:13:51 EST 2007 | hegemon
We have found differing results based on the pattern used when reducing to total % of solder paste on the center pad. We arrived at 68% coverage on the center pad, and 1:1 for the perimeter pads. To get the 68% coverage we used a number of differen
Electronics Forum | Thu May 13 10:41:39 EDT 1999 | Alberto Kaufman
I am trying to find information on soldering materials market ($),different fields soldering materials are used, prospects on market development,etc
Electronics Forum | Wed May 05 20:58:40 EDT 2010 | aungthura
Hi Stephen Our boards are as large as 600x600mm and sometimes 8 or 12 layers thick.And,there are many various components in different material.So, we are seeking the soldering machine which can supprot zero delta T.Thus, we consider to try with Vapor
