Electronics Forum | Wed Jul 28 17:46:13 EDT 2004 | Steve Stach
Both temperature and humidity can cause solder paste to behave in a way to cause these formations. Temperature can cause slumping, slumping spreads out the paste, upon reflow perimeter paste does not join the bulk, and because of insuffient oxide
Electronics Forum | Wed Dec 09 22:40:48 EST 1998 | phillip fhunter
| Hi, I know for sure that by controlling temp. and humidity | conditions in SMT assy lines room, one gets advantage in | screen printing, adhesive dispensing, and pick&place | machines mainteinance. Does any one have any advice on why | else is a c
Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao
Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon
Electronics Forum | Fri Jan 29 05:14:06 EST 1999 | Graham Naisbitt
Hi guys, I really am at a loss to understand this one. It would appear that there may be some reaction between the flux and the resist? Or maybe you have an OSP on the board that is reacting during soldering? As a fast fix, maybe you should try a
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Wed Feb 10 12:52:21 EST 1999 | Dick Casagrande
|I'm getting in a little late on this but my 2 cents is: We have been using no-clean flux for a few years now but up till last month were still cleaning (the white residue) our boards (all thru hole). Finally did some investigation and found the flux
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