Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Sun Sep 29 13:04:58 EDT 2013 | KIC-Tech Service
Sr. Tech, As far as I’m aware, most if not all, manufactures of thermal profilers offer K type thermocouples as a standard for profiling in the electronics manufacturing industry. In my decades of experience in the reflow and wave solder industry, t
Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Mon Jul 12 13:06:32 EDT 1999 | Earl Moon
| I had parts replaced on SMT PWBs and the repair created measling defects. | Reliability Question: | Q1. Can measling be aggrevated or grow over time due to | temperature cycling and moisture. Customer environment is | -62C to +85C. | | Thank
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc
I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to
Electronics Forum | Mon Jul 07 11:45:45 EDT 2003 | lromero
Do you know what the maximum temperature rating is for the devices. But in my past experience you could be seeing the following. Excess thermal ramp rates typically you would like to see 2 to 3C/sec in the reflow oven, if it is greater than this i wo
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Thu Dec 03 14:51:57 EST 2015 | proceng1
The problem we ran into trying to do more intrusive reflow is that many of the TH parts could not withstand the temperatures for the reflow cycle. Solder preforms that could be placed by the Pick and Place was one of the avenues I explored trying to
