Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn
if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between
Electronics Forum | Mon Feb 25 12:21:16 EST 2008 | stevek
Rather than having the artwork cover the via as with tenting dry film, and letting the mask do what it will, the preferred way is to do a second op silk screen with something like SR1000 just in the vias themselves to plug them. This doesn't always
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Tue Mar 22 08:05:59 EST 2005 | jdumont
Morning all, my question is regarding the use of filled/tented/plugged vias on the BGA site. What are you guys doing for this? What type of issues can this cause if using none, or the improper via design. Regards, JD
Electronics Forum | Thu Feb 21 14:54:36 EST 2008 | shrek
KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap, have you tried to adjust wave parameters? i've read threads here that a vibrating wave will tend to push solder up through holes.
Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma
What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
