Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Fri Jun 15 09:59:29 EDT 2001 | brownsj
We have recently had an incident where we feel that we have received a batch of cards from our assembly house which have by-passed their ICT operation. This has been determined by the lack of any indentations on the test pads from the sprung probes.
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Fri Jul 16 10:55:54 EDT 1999 | Jeff Ferry
We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads a
Electronics Forum | Thu Jul 22 03:58:28 EDT 1999 | George Verboven (Process Engineer)
| We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads
Electronics Forum | Sat Sep 26 14:07:09 EDT 2020 | davef
Print no paste on the tin-plated, [test???] pad. Experiment by putting Kapton tape over the stencil aperture for the tin platted pad. Re-assess your reflow profile, since the liquidus of the two plating materials will be different. Evaluate your pa
Electronics Forum | Fri Apr 30 12:34:12 EDT 2004 | Bryan She
Hello all, these days I've met an OSP board testability issue. 1.OSP board 2.Solder paste:Kester R244 no clean paste 3.Print solder paste on test pad. Issue: There's brone(light yellow)flux residue on test pad,and the probe can't penetrate the residu
Electronics Forum | Wed Jul 01 10:17:35 EDT 2009 | davef
So, would putting insulating pads on the test fixtures without pads make this issue go away?
