Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
New Equipment | Selective Soldering
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
New Equipment | Selective Soldering
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
1200MM/1500MM Online SPI , Big Size Solder Paste Inspection Machine mail: sales@smtlinemachine.com whatapp/wechat:+8613537875415 Specification: 技术参数/Parameters 技术平台/Technology Platform super big size platform 适用
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
