Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Thu Jun 14 23:21:30 EDT 2001 | oem boy
I am working on 0201 development for my company in the UK, and I am planning a rather extensive DOE for my reflow oven profile. I am planning on studying various ramp rates, soak times, times above liquidus, peak temps, etc... My biggest concern
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Thu Aug 26 03:22:06 EDT 1999 | Jacqueline Coia
Hi There, Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have a part
Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Tue Nov 09 12:41:31 EST 2004 | alanhayllar
What thermally conductive glues are available to glue Luxeon Lumiled parts down? Are single part glues without an activator available, suitable for screen printing or dispensing? Many thanks
Electronics Forum | Tue Jul 18 22:11:13 EDT 2006 | davef
Aping Russ' reply: * ~70% of the time solder on gold fingers is caused by poor printing and handling processes. * ~25% of the time solder on gold fingers is caused by poor thermal recipe when soldering. * ~5% of the time solder on gold fingers is cau
Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss
Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?
Electronics Forum | Mon Mar 20 22:39:03 EST 2006 | davef
Pavel Point: You suspect that solder paste can easily get to solder mask causing beading, because the aperture is larger than the component pad. Comment: Probably, this is incorrect. We overprint on solder mask all day long when doing paste-in-hol
Electronics Forum | Thu Sep 02 21:19:25 EDT 1999 | NAZEEH CHAUDRY
| | Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | | | | Insufficient solderpaste. "No flux" (sat too long after print). | | Those are what I've experienced. | cbga or pbga if pbga check thermal prof
