Electronics Forum | Wed Dec 26 16:52:57 EST 2012 | davef
"Advantages of Bismuth-based Alloys for Low Temperature Pb-Free Soldering and Rework" Author: Brook Sandy, Edward Briggs and Ronald Lasky, Ph.D. Abstract: The increased function of personal electronic devices, such as mobile phones and personal mus
Electronics Forum | Sun Mar 09 19:03:48 EST 2003 | Dean
For the reflow process check out KIC THERMAL at kicthermal.com. They make a product called 24/7 which can collects data for process capability. I beta tested the unit about 2 years ago....interesting stuff.
Electronics Forum | Fri Dec 07 07:23:58 EST 2018 | vinzon02
Hi Thus anybody here have experience on Thermal Conductive Adhesive Sheets? We have one IC component that need to be place with this material to fill in the gap between the pcb and space on its body. Currently we are performing this manually by, a
Electronics Forum | Tue Aug 15 14:32:23 EDT 2023 | emeto
I think this part has terrible thermal balance. I assume in reflow process the part is bending so much that it will cause the shorts you see. I would suggest you get one of these beautiful hi temp cameras and record the reflow process. This video sho
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Wed Jul 03 10:50:06 EDT 2019 | rgduval
An 8 zone oven will give you better thermal control over the whole process. It's useful for lead-free soldering, or for boards with varying thermal loads/shadowing, etc. You can make a 5 zone work for lead free, provided the boards don't have signi
Electronics Forum | Fri Dec 30 11:54:53 EST 2005 | John S.
Seen cap cracking before. It can be caused by thermal stress as noted above, but don't discount mechanical stress and handling. Your depanelization method is a strong candidate. We applied strain gages to baords and benchmarked various mechanical
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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Florham Park, NJ USA
Phone: 973-377-6800
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