Electronics Forum | Thu Sep 02 12:27:27 EDT 2010 | frankmurch
Voiding is tricky, but some pastes have flux residue that can escape others don’t. It is normally called out. So I would change pastes. If you do not want to do that, try a slightly longer time above eutectic (give the flux a little more time to get
Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
Electronics Forum | Mon Feb 12 13:15:14 EST 2007 | realchunks
Does this meet the SMQ230 recommended time above liquidous? Do you have any parts that cannot withstand 239 degress C? If meet SMQ230's recommended time and temps and your parts are rated for this temp, then you should be OK. The real proof is ref
Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics
Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in
Electronics Forum | Mon Jun 16 16:57:34 EDT 2008 | ldavis
We are using VP on all of our lead free assemblies. 1. We are getting great, very repeatable results. 2. The profiles were created during the implementation of the equipment and we only change 3 parameters for each assembly processed. Heater power,
Electronics Forum | Mon Jul 19 21:25:28 EDT 2004 | davef
It seems like the flux is burning-up before the metal begins to flow on this slightly odd component. Alpha talks about alternate reflow recipes for WS609, as follows: * A straight ramp up profile is preferred for reflowing low to medium thermal mass
Electronics Forum | Thu Jan 29 11:30:56 EST 2009 | rgduval
As others have said, you'll have some difficulties getting good reflow on pb-free out of a 3-zone oven. We did it with a 4-zone for awhile, but only had really good success on low thermal density boards. That said, you should definitely check your
Electronics Forum | Mon Jan 20 13:51:12 EST 2003 | slthomas
I seem to recall seeing some references to controlling the time above 205�C as a critical parameter, although I can't find it in the archives anywhere other than one reference to a maximum of 45 seconds. What's ideal (typically....I realize differen
Electronics Forum | Fri Jul 22 16:42:50 EDT 2005 | campos
hello all, I�m experiencing problems with "warped" boards after first reflow, some of them i just can�t print side two due to this problem,,is it related only to reflow? i�m using a linear profile (225� peak / 70s time above) with a tin lead paste,t
