Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Fri Nov 03 15:31:18 EST 2006 | Steve
Mika, It's not my company, I've used them in the past to re-ball some BGA's for me. They always do a moisture removal bake on moisture sensitve devices prior to ball attach, and then pack them in a vacuum sealed moisture barrier bag when they retu
Electronics Forum | Wed Feb 09 21:33:32 EST 2000 | Dave F
Ashok: I have three answers to your questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opene
Electronics Forum | Sun May 08 00:07:42 EDT 2005 | Dr . Klein
Hello mrmaint You say that you do 100% incoming inspection at your site, Do you open every tray and look on the writing on every type of component? If you open the bag, how do you close it again (vacuum machine)? What is the inspection process? (Only
Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan
I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use
Electronics Forum | Tue Aug 19 12:15:37 EDT 2003 | D Peter
Again, that is for packaging, rather than moisture removal or storage. Those guidlines are for several reasons, preventing low pressure outgassing or disassociation of the dessicants, damage to parts or wafer tray due to forces on the evacuated pack
Electronics Forum | Sun Jul 12 01:23:38 EDT 1998 | Mike Cox
| There's a company out the that makes air sleds for moving equipment around. Air sleds are heavy duty plastic plastic bags with lots of little holes in the under-side. The bag is positioned under the equipment. A vacuum cleaner, hooked-up backwar
Electronics Forum | Fri Jul 10 09:17:13 EDT 1998 | justin medernach
| There's a company out the that makes air sleds for moving equipment around. Air sleds are heavy duty plastic plastic bags with lots of little holes in the under-side. The bag is positioned under the equipment. A vacuum cleaner, hooked-up backwar
Electronics Forum | Mon Jul 15 14:10:38 EDT 2013 | cyber_wolf
One of our aerospace customers "suggested" we vacuum seal MSD components. We bought a vacuum sealer and we are deciding whether or not to vacuum seal ALL MSD parts or just aerospace. Our current method consist of desiccant, a humidity card and a bag
