Electronics Forum | Tue Nov 14 14:26:28 EST 2000 | Francois
First groupe of questions: Is your machine have one head with multiple nozzles? Do you have separate vacuum tubes for each nozzle? Do you have problem with the same package or with all pakages. In your PNP machine, what are the dimensions tolerances
Electronics Forum | Fri Oct 23 15:19:38 EDT 1998 | Dave f
| Hello : | Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. M
Electronics Forum | Wed Sep 22 16:48:40 EDT 1999 | C.K.
Question for you SMT guru's out there. What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: 1.) Custom b
Electronics Forum | Wed Sep 22 16:51:05 EDT 1999 | C.K.
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
Electronics Forum | Thu Sep 23 10:20:58 EDT 1999 | Earl Moon
| Question for you SMT guru's out there. | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: | | 1.
Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Sun Nov 01 21:01:26 EST 2009 | isd_jwendell
I'm at 6800 ft. The only issue I had was related to a PEM nut that was not packaged properly. There was a piece of K@pton tape that was not centered on the part and the tape would stick to the carrier. The vacuum on my machine would not allow me to
Electronics Forum | Wed May 29 15:29:41 EDT 2002 | zanolli
Hello Peterson, If the contact tails protruded enough on the underside of the PCB, then you could do a "reverse" press fit. I do not believe that to be the case with the VHDM. Placement equipment is out of my bailiwick but; Usually small SMT connec
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Sat Jun 28 13:53:07 EDT 2008 | sleech
Fowler: Thank you for your documentation. Your finding roughly coincide with our own. We also found that 70 degree baking removes 50%/60% of the ingested moisture from moisture conditioned MSD packages We ran an additional experiment that compared
