New SMT Equipment: via hole tenting (Page 4 of 34)

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

MARCH VIA Series Plasma Treatment

MARCH VIA Series Plasma Treatment

New Equipment | Surface Finish

VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels.  The MaxVIA, MaxVIA-Plus, and ModVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabil

MARCH Products | Nordson Electronics Solutions

3 Stage Stack Via HDI Board

3 Stage Stack Via HDI Board

New Equipment | Prototyping

Project Description | Parameters 10 Layer (3 Stage) Thickness: 1.6+/-0.16 mm Min Hole Size: Via: 0.25 mm                       Blind Via: 0.15mm  Width/Space: 0.1mm/0.08 mm Surface Treatment: ENIG | Craft 3 Stage HDI | Application Industrial Contr

Headpcb

Printed Circuit Boards

New Equipment |  

Up to 30 layers, down to 3 mil traces / spaces, 6 mil drilled holes. MIL-P-55110 approved for FR-4, polyimide, PTFE, epoxy Thermount(tm). Copper Sealed Vias are available. Deliveries down to 24 hours are available.

Speedy Circuits, div. of PJC Technologies, Inc.

High Tg PCB

High Tg PCB

New Equipment |  

1. FR-4 Tg170 2. 20 layer, 1.6mm thick 3. 1 oz copper finished 4. 10% impedance control 5. Blind/buried vias 6. 0.1mm holes, HDI 7. Application: telecommunication, industrial control, medical equipment

Bicheng Enterprise Company

4 Layers Rogers pcb

4 Layers Rogers pcb

New Equipment | Assembly Services

4 layer PCB Material: Rogers 5880 Finished Thickness :2.0 mm; Copper thickness : 1OZ finished ; Surface finishing: Immersion Tin Min Via hole size :0.30mm; Min Trace width/ spacing : 0.13 mm / 0.13 mm

YOUNG HE ELECTRONIC TECHNOLOGY CO.,LIMITED

Back Plane Board

Back Plane Board

New Equipment | Prototyping

Project Description | Parameters 32 Layer  Thickness: 6.2+/-0.62 mm Size: 870*540mm Min Hole Size: Via: 0.65 mm  Width/Space: 0.1mm/0.15 mm Surface Treatment: ENIG | Craft 32 Layer Unsymmetrical Layup Strcture | Application Base Station

Headpcb

10 Layer 2 Stage BVH Board

10 Layer 2 Stage BVH Board

New Equipment | Prototyping

Project Description | Parameters 10 Layer (2 Stage) Thickness: 2.0+/-0.2 mm Min Hole Size: Via: 0.2 mm                       Blind Via: 0.1mm Width/Space: 0.08mm/0.08 mm Surface Treatment: ENIG | Craft 2 Stage BVH | Application Industrial Control 

Headpcb

Impedance control PCB

Impedance control PCB

New Equipment | Components

Bicheng provides impedance controlled PCB's for R&D, high-tech, IT research companies and organizations, large or small. Technical parameters *Controlled dielectric            *Controlled impedance            *Design coupons  *Test coupons *Po

Bicheng Enterprise Company

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

RF/Microwave PCB Fabrication: Single Layer - Double Layer - Multi-Layer - Plated Through Holes

New Equipment | Fabrication Services

RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban

Advanced Circuitry International


via hole tenting searches for Companies, Equipment, Machines, Suppliers & Information

ISVI High Resolution Fast Speed Industrial Cameras

High Throughput Reflow Oven
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Training online, at your facility, or at one of our worldwide training centers"
Fluid Dispensing, Staking, TIM, Solder Paste

World's Best Reflow Oven Customizable for Unique Applications
Pillarhouse USA for Selective Soldering Needs

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...