Electronics Forum | Thu Sep 23 18:36:55 EDT 2021 | billmeye
Attached is a good starting point. We also have Mydata and have had many different people providing names. Some used standard units, other metric. Try to stick with all metric and use prefixes that match up with the component type and pin count if
Electronics Forum | Tue Mar 29 15:17:19 EDT 2011 | davef
The minimum via hole size used will have a significant effect on the cost of the board as it limits the number of PCBs that can be drilled as a stack. Not withstanding the radio performance implications of small diameter via holes, typical minimum si
Electronics Forum | Tue Jul 31 20:05:11 EDT 2001 | davef
There is no the industry standard specification for resisitivity monitoring at aqueous cleaning. Beyond those posted here earlier by Mikie, guidelines can be found in the fine SMTnet Archives, for instance: (http://www.smtnet.com/Forums/Index.cfm?CF
Electronics Forum | Mon Jun 16 12:06:52 EDT 2008 | realchunks
Seen this with our old board house. The uncured board is causing your problem. Hard to catch, but looks like you have all your ducks in a row. We presented the exact same thing to our board house, and naturally they blamed our process, handling, a
Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Tue May 20 06:14:32 EDT 2008 | roc2x
Hi, Im qulifiying 2 PCB supplier and supplier A has no defect found but supplier B got 4 defective cards and 4 are same failure. 4 cards having lifted pad after reflow in same BGa location. I run the 2 PCb supplier in one reflow,using same profile,sa
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Tue Sep 21 18:51:15 EDT 2021 | dem_radar_mfg
Pretty new SMT process engineer here. Context: we are using a MyData100 and using MYcenter software with it. Most package naming conventions only define outer area/foot print dimensions. However, I do not know of any convention for further package de
Electronics Forum | Thu Sep 23 19:52:12 EDT 2021 | stephendo
If you like that one then you might also like this one. https://www.topline.tv/products.cfm A few lifetimes ago,I would always make sure I had a copy of the Topline brochure. They make dummy parts and their borchure had them organised nicely. You w
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