Electronics Forum | Wed Oct 10 13:35:00 EDT 2001 | stepheno
I used to work with Chris. (neither of us are there anymore). What is he talking about is putting components into "pockets". The parts would come in, in sticks (tubes) but we wanted them in reels. At first we sent them out to be reeled, but that w
Electronics Forum | Fri Aug 23 16:02:37 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John Lau; McGraw-Hill Professional; ISBN: 0071351418; 2000 * Chapter 6. Flip Chip on Board with Conventional Underfills. * Chapter 7. Flip Chip on Board with No-Flow Underfills. * C
Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Wed Aug 22 14:25:22 EDT 2007 | russ
Go inform the owner of your company that you are spending hours of labor dealing with these parts instead of spending the extra 4 dollars it takes to buy an entire reel. When we deal with strips we make sure that an extra amount is ordered to apply
Electronics Forum | Wed Sep 12 17:09:11 EDT 2007 | allwave
HI John, I use wave fixtures with titanium inserts. So far I have not seen any problem with walls about 0.010" thickness and 0.120" tall (or deep depending how you see it)...The Titanium-composite interface is also very strong (as long as you have e
Electronics Forum | Tue Sep 29 11:49:02 EDT 2015 | spoiltforchoice
Typically - hand soldering as you are currently doing. Should your volume justify it you can invest in a selective soldering solution, these might take the form of a robotic arm that essentially replicates manual soldering or a solder jet similar to
Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny
Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Electronics Forum | Tue Aug 28 12:35:38 EDT 2001 | seand
Hello Paul, Without all of the specific details of your product I would recommend providing the BOMs and samples to a couple of vendors and have them prove their capabilities. The Siplace platform is a solid platform for your application and the ap
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed