Electronics Forum | Mon Mar 07 15:35:35 EST 2005 | John M
It has been my experience that the standard Fr4 material (Tg 135c) will discolor when processed at the new higher temperatures required for the high tin alloys... We have been using the High Tg Fr4 (Tg 170c) for many years to ensure this does not hap
Electronics Forum | Fri Feb 04 15:42:34 EST 2005 | Indy
Do a search for SAC305. There will be lots of answers. Jay Brower has done good work on it. Cheers Indy
Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
Electronics Forum | Mon Feb 07 20:05:01 EST 2005 | davef
Here's a similar thread: http://lists.smartgroup.org/SCRIPTS/WA-SMARTGROUP.EXE?A2=ind0403&L=smart-e-link&F=&S=&P=17013
Electronics Forum | Mon Feb 07 21:28:42 EST 2005 | Grant
Hi, That link above points to a weird forum, and I have no idea how to use it. Was there any reply to the original post on that forum? Some posts here on it would be good. Regards, Grant
Electronics Forum | Wed Feb 16 14:50:46 EST 2005 | Valerie
You could have a supplier problem. We had a similiar problem with one of our capacitor suppliers. I would suggest doing a solderability test on the component right out of the tape.
Electronics Forum | Wed Feb 16 17:38:17 EST 2005 | russ
have you checked the registration of the component prior to reflow? If this is good, why don't you take another P/N (0805)that is okay and place of few of them in the trouble spots and see what happens.
Electronics Forum | Thu Feb 17 04:09:19 EST 2005 | greg
The solder adheres to the lands very well so i don't think that problem is with solderability of the PCB. Not wetting to the 0805 terminations. When the problem appeared with the 0805 we chenged the supplier. But there was commnon element Pb-free te
Electronics Forum | Thu Feb 17 08:14:57 EST 2005 | davef
The issue may not be the solderability protection. It could be that the metalization on the component terminal or the metal of the component terminal was not prepared properly before the solderability protection was added.
Electronics Forum | Thu Feb 17 12:04:52 EST 2005 | Indy
Have you tried doing solder dip test on these components? Or a Leaching Test, to see if the solder catches on the termination ? I suggest you should try these tests.. Cheers Indy
