Electronics Forum: corners (Page 34 of 68)

Component location related to Fiducial marks

Electronics Forum | Tue Sep 07 10:05:33 EDT 2004 | russ

Components do not have to be in the framework of the fiducials. It is recommended that the fiducials are at the outer extremeties in at least 3 corners of the assembly however. It is also a good idea to keep a minimum "keepout" area around them of

NEED DEPANELIZING MACHINE

Electronics Forum | Wed Sep 15 11:33:12 EDT 2004 | sue ph

We are building seven different assemblies that have flex circuitry that go off in four different directions within the panel. The panels are square to facilitate flow through smt & wave solder and depanilized in solder touchup. Currently, we are usi

Problem with conformal coating

Electronics Forum | Thu Feb 17 10:33:53 EST 2005 | Frank R.

I use conformal coating DYMAX #984-LVUF and I don't know if it's a problem of viscosity but 0805 components are not covered properly. We use a dispensor to applied it and we cured it by UV. Even if I apply a thicker layer, the coating seems to have

Pick and Place Machine Validation

Electronics Forum | Thu Mar 10 12:19:17 EST 2005 | rlackey

Borrow a large hungry dog (or wolf if local wildlife permits) & chain it up in the corner of the office when the salesman comes in. Then look over at it repeatedly whilst talking about your requirements. Feel free to leave him alone for a while...

Type of NEXLEV Connector

Electronics Forum | Sat Apr 23 13:54:09 EDT 2005 | Indy

I don't know wat are the types.. but wat I can tell you is you need care while profiling them. it needs a peak of around 215-220 if Sn/Pb.. at the ball. So the plastic on top will reach a higher temp. Care must be taken so that it doesn't roast. al

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto

We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont

We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte

BGA placement using MCS-16 & IP-3

Electronics Forum | Fri Jun 24 01:01:41 EDT 2005 | FAC

If you are only concerned with the outline and it has 4 corners, VT-10 or 254 will work with backlighting. If the FIP3 machine has a 4400 card installed, frontlighting with high I/O counts could take a while during vision processing. If your machine

QFP Solder PROBLEM

Electronics Forum | Thu Aug 25 08:54:24 EDT 2005 | stepheniii

Could it be cold solder? Are there parts nearby that might be soaking up lots of heat, or maybe lots of internal grounding near that corner? Once I saw something similar except it was on two different assemblies. Each time it was on the side of the

Matrix Trays

Electronics Forum | Mon Aug 22 09:57:46 EDT 2005 | gavinscott

Hi All, The method that I use when training operators is.. a visual aid that shows the operators what way the trays are placed into the machine and the polarity of the component and also the component change logs. The matrix trays that I have delt w


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