Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F
Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
Electronics Forum | Tue Jun 20 20:31:12 EDT 2000 | Dave F
Chrys you're fine. On scoring: * Be sure spec material remaining, not what is removed. * Be sure that the v-grooves are perpendicular to each other, not off set. * Typ spec for for .062 thick boards FR-4 0.018-0.024 MC-3 0.030-0.040 * HADCO recomm
Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo
Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so
Electronics Forum | Tue Mar 13 02:18:07 EST 2001 | JT
Biggest problem with the IIF is placing components with varying thickness (i.e. multpile vendors). We have to adjust production programs at start of each run to prevent excess scrap. Line Sensor tolerances can be adjusted to accept a wider range of
Electronics Forum | Fri Jun 15 09:13:53 EDT 2001 | jackofallprocesses
Does anyone have knowledge or experience with Pin & Paste on boards that are .095" thick? The boards would have mixed technology, PTH, fine pitch, and BGAs. I did a search for this info and nothing touches on this particular subject, thicker boards.
Electronics Forum | Wed Jan 19 11:37:18 EST 2000 | Mark D. Milward
Does anyone consider the use of a Cyberoptics LSM solder paste thickness measurement system to be a valid test in determining the viscosity of solder paste. This procedure was proposed as an alternative to using the Malcolm gage for viscosity testing
Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F
Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
Electronics Forum | Fri Feb 12 19:02:21 EST 1999 | Jon Medernach
|As the squeegee shears the paste at the face of the stencil the vehicle used to contain the solder spheres compresses and expands out the top of the opening after the squeegee passes. This is 1 or 2 mil at most. The peaks should not be considered
