Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Fri Jun 30 20:39:52 EDT 2006 | johnwnz
Grant, Haven't doen any work with the SN100C paste, the problem I guess is yoru subject to the suppliers flux base so if that is poor then the alloy may not perform as well as it could. We've found Avantec to be pretty good at SMT but have got SN100C
Electronics Forum | Tue Jun 27 13:38:35 EDT 2006 | ChrisG
Stephen has a good point. You could buy a used oven. I know of several used ones that are completely refurbished for about 15-25K. But these are BTU P-70's and P-98's. The main problem here is frequency. Most of their ovens operate at 50 or 60
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Thu Apr 05 09:17:40 EDT 2007 | itaig1
I have seen a method used where the pins on the connector are of the same materials as the thermocouple and the connector is connected via single strand wires of the same material to the PCB however the wires were spot welded to bare copper pads to r
Electronics Forum | Mon Nov 07 19:33:10 EST 2011 | swag
We have four pick and place machines all exibiting a residue that seems to build up over time on wiring and electrical components. This residue appears as a white haze on wiring, caps and fuses (these are the components where it is most obvious). Y
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro
There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so
