Electronics Forum | Fri Jul 30 17:26:02 EDT 1999 | John Thorup
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Thu Jul 22 12:05:33 EDT 1999 | John Thorup
| | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | |
Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray
| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Thu Jul 15 21:10:53 EDT 1999 | Scott McKee
| I was wondering if someone could help me with a little problem I am Having with a MyData TP-11 UFP running TPSys 1.4.2. Early this week the machine crashed and I had to reload the software. I re-insatalled Venix then the CP4 driver then TPsys and S
Electronics Forum | Fri Jul 16 05:48:06 EDT 1999 | Wayne Sanita
Give Mydata a call as Scott said, they will take step by step over the phone. Wayne | | I was wondering if someone could help me with a little problem I am Having with a MyData TP-11 UFP running TPSys 1.4.2. Early this week the machine crashed an
Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy
| | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but
Electronics Forum | Fri Jul 16 06:22:31 EDT 1999 | Wayne Sanita
Mark, I had the same peoblem. For my stencils i use a 15% reduction for the width of fine pitch leads only, as Earl said follow the 1:1.5 standard. We consider pitches of 32mil and under. We also clean the stencil every other board to ensure no caki
