Electronics Forum: assemble/ (Page 337 of 598)

Multi-part reeling for pick and place

Electronics Forum | Sat Jul 17 15:22:17 EDT 2004 | rohman23

Thanks for all the responses. I do agree with what was said, and can certainly see reasons not to try. I'll write a little more about what we do. We are a defense contractor, and as I mentioned very high mix, low volume. We only have 1 SMT line.

Inspection magnifier

Electronics Forum | Fri Jul 16 15:07:11 EDT 2004 | waveroom

Good question, we are a distributor and have offered lots of different magnifiers. We finally decided to stick with only one brand. It's not the least expensive but the quality and warranty are superior to any other. That would be OC White. I replac

History of Mass Soldering

Electronics Forum | Thu Sep 09 11:30:03 EDT 2004 | Tim Lawrence

Hi I came across this article while writing a paper. I don't know if it's the first, but it is early wave soldering: W L Oates, "Automatic Soldering Machines for Printed Circuit Board Assemblies", IRE National Convesntion Record, Vol. 6, No. 6, pa

PCBA IC Component rework

Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince

The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If

lead free platings and tin lead

Electronics Forum | Tue Aug 31 19:50:44 EDT 2004 | davef

To take our turn at keeping everyone else on the straight and narrow. For more on lead contamination of no-lead solder, look here: http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Free%20Electronics%20Assembly.pdf [We apolog

Ion exchanger

Electronics Forum | Thu Sep 02 16:47:08 EDT 2004 | Irun

Hi all I have a question about DI water for cleaning system. What water quality should ionic exchanger produce for assembly cleaning (SMD and THT components with BGA and microwave application). What is recommend water conduction and minimal level (0.

Component location related to Fiducial marks

Electronics Forum | Tue Sep 07 10:05:33 EDT 2004 | russ

Components do not have to be in the framework of the fiducials. It is recommended that the fiducials are at the outer extremeties in at least 3 corners of the assembly however. It is also a good idea to keep a minimum "keepout" area around them of

Double-Sided BGA Process

Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS

Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple

NEED DEPANELIZING MACHINE

Electronics Forum | Wed Sep 15 11:33:12 EDT 2004 | sue ph

We are building seven different assemblies that have flex circuitry that go off in four different directions within the panel. The panels are square to facilitate flow through smt & wave solder and depanilized in solder touchup. Currently, we are usi

Re-use of SMT Components after Removal

Electronics Forum | Thu Sep 23 02:52:21 EDT 2004 | johnwnz

olks, got one for you. What is the feeling on reusing SMT components that you have removed from an assembled PCBA? For example, you place your IC's and they are 180 deg out, you have to remove them.... but what about refiting the same devices? Are t


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